表面应力引起的弹性薄膜形状分叉

闫琨; 何陵辉; 刘人怀

表面应力引起的弹性薄膜形状分叉

1.
中国科学技术大学, 材料力学行为和设计重点实验室, 合肥, 230027;
2.
暨南大学, 应用力学研究所, 广州, 510632

详细信息

作者简介:
闫琨(1979- ),女,湖北人,硕士研究生(E-mail:kyan@mail.ustc.edu.cn).

中图分类号: O344.3
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- 被引次数: 0
出版历程
- 收稿日期: 2002-08-05
- 修回日期: 2003-05-13
- 刊出日期: 2003-10-15

Shape Bifurcation of an Elastic Wafer Due to Surface Stress

1.
University of Science and Technology of China, Hefei 230027, P.R.China;
2.
Institute of Applied Mechanics, Jinan University, Guangzhou 510632, P.R.China

摘要

摘要: 此工作致力于无约束各向同性弹性薄膜在表面应力发生变化时几何非线性变形分析。基于能量的考虑,导出了曲率与表面应力变化量的关系。与已有线弹性分析结果的显著区别是,当薄膜很薄而上下表面应力差足够大时,薄膜曲率的解不再唯一,而会发生分叉。
- 弹性薄膜 /
- 曲率 /
- 表面应力 /
- 几何非线性
Abstract: A geometrically nonlinear analysis was proposed for the deformation of a free standing elastically isotropic wafer caused by the surface stress change on one surface.The link between the curvature and the change in surface stress was obtained analytically from energetic consideration.In contrast to the existing linear analysis,a remarkable consequence is that,when the wafer is very thin or the surface stress difference between the two major surfaces is large enough,the shape of the wafer will bifurcate.
- elastic wafer /
- curvature /
- surface stress /
- geometric nonlinearity

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参考文献(15)

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