塑料封装集成电路结构热应力分布的解析解

刘玉岚; 王彪; 王殿富

塑料封装集成电路结构热应力分布的解析解

哈尔滨工业大学复合材料研究所, 哈尔滨 150001

详细信息

作者简介:
刘玉岚(1962- ),女,吉林市人,副教授,博士(E-mail:myliu51@hotmail.com).

中图分类号: O31
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- 被引次数: 0
出版历程
- 收稿日期: 2001-08-20
- 修回日期: 2002-06-04
- 刊出日期: 2003-02-15

Analytical Solutions of Thermal Stress Distribution in Plastic Encapsulated Integrated Circuit Packages

Research Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, P. R. China

摘要

摘要: 由于集成电路的硅芯片与其周围的塑料封装材料热膨胀系数的不协调,产生的热残余力会直接导致封装结构的破坏及集成电路的失效.将硅芯片的角点结构模化成半无限大楔体,求得了热应力分布的解析解.在此基础上,应用应变能密度因子准则评价电子封装结构角点处的开裂强度及开裂方向.
- 微电子封装结构 /
- 热应力 /
- 解析解
Abstract: Due to the mismatch in the coefficients of thermal expansion of slicon chip and the surrounding plastic encapsulation materials, the induced thermal stress is the main cause for die and encapsulant rupture. The corner geometry is simplified as the semi-infinite wedge. Then the two-dimensional thermal stress distribution around the corner was obtained explicitly. Based on the stress calculation, the strain energy density factor criterion is used to evaluate the strength of the structure, which can not only give the critical condition for the stresses, but also determine the direction of fracture initiation around the corner.
- elcetronic package structure /
- thermal stress /
- analytical solution

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参考文献(15)

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