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低压对变温环境下高聚物黏结炸药界面损伤的抑制

张超 刘占芳

张超, 刘占芳. 低压对变温环境下高聚物黏结炸药界面损伤的抑制[J]. 应用数学和力学, 2020, 41(10): 1057-1071. doi: 10.21656/1000-0887.410092
引用本文: 张超, 刘占芳. 低压对变温环境下高聚物黏结炸药界面损伤的抑制[J]. 应用数学和力学, 2020, 41(10): 1057-1071. doi: 10.21656/1000-0887.410092
ZHANG Chao, LIU Zhanfang. Inhibition of Low Pressure on Interfacial Damage in Polymer Bonded Explosive Under Temperature Fluctuation[J]. Applied Mathematics and Mechanics, 2020, 41(10): 1057-1071. doi: 10.21656/1000-0887.410092
Citation: ZHANG Chao, LIU Zhanfang. Inhibition of Low Pressure on Interfacial Damage in Polymer Bonded Explosive Under Temperature Fluctuation[J]. Applied Mathematics and Mechanics, 2020, 41(10): 1057-1071. doi: 10.21656/1000-0887.410092

低压对变温环境下高聚物黏结炸药界面损伤的抑制

doi: 10.21656/1000-0887.410092
基金项目: 国家自然科学基金(51375416)
详细信息
    作者简介:

    张超(1993—),男,硕士生(E-mail: 799068902@qq.com);刘占芳(1963—),男,教授,博士生导师(通讯作者. E-mail: zhanfang@cqu.edu.cn).

  • 中图分类号: O34

Inhibition of Low Pressure on Interfacial Damage in Polymer Bonded Explosive Under Temperature Fluctuation

Funds: The National Natural Science Foundation of China(51375416)
  • 摘要: 该文旨在探究低压对变温环境下高聚物黏结炸药(polymer-bonded explosive,PBX)界面损伤的影响.首先基于Voronoi法生成PBX二维几何模型,并考虑炸药晶体颗粒为弹塑性、黏结剂为双层黏塑性以及采用零厚度内聚力模型反映界面黏结状况,研究了温度变化时PBX界面黏结性能的改变;再基于热力耦合处理方法,研究了低压对变温环境下PBX界面损伤的抑制作用,拟合了降温阶段界面法向应力随低压变化的曲线.结果表明,升温阶段主要是由界面切向应力导致初始损伤,降温阶段主要是界面法向应力导致界面损伤,降温比升温更容易导致界面损伤;无论升温或降温,一定的低压载荷能够抑制界面损伤,但压力过大可能导致新的损伤;为抑制界面损伤,降温过程需要的压力应高于升温过程需要的压力,这与降温阶段的界面损伤较大是一致的.
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出版历程
  • 收稿日期:  2020-04-02
  • 修回日期:  2020-09-20
  • 刊出日期:  2020-10-01

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