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含圆孔功能梯度压电材料板的力电耦合三维解析解

张友源 范慧朵 沈璐璐 杨博

张友源, 范慧朵, 沈璐璐, 杨博. 含圆孔功能梯度压电材料板的力电耦合三维解析解[J]. 应用数学和力学, 2025, 46(11): 1416-1428. doi: 10.21656/1000-0887.460016
引用本文: 张友源, 范慧朵, 沈璐璐, 杨博. 含圆孔功能梯度压电材料板的力电耦合三维解析解[J]. 应用数学和力学, 2025, 46(11): 1416-1428. doi: 10.21656/1000-0887.460016
ZHANG Youyuan, FAN Huiduo, SHEN Lulu, YANG Bo. 3D Analytical Solutions of Mechatronic Coupling for Functionally Graded Piezoelectric Material Plates With a Circular Hole[J]. Applied Mathematics and Mechanics, 2025, 46(11): 1416-1428. doi: 10.21656/1000-0887.460016
Citation: ZHANG Youyuan, FAN Huiduo, SHEN Lulu, YANG Bo. 3D Analytical Solutions of Mechatronic Coupling for Functionally Graded Piezoelectric Material Plates With a Circular Hole[J]. Applied Mathematics and Mechanics, 2025, 46(11): 1416-1428. doi: 10.21656/1000-0887.460016

含圆孔功能梯度压电材料板的力电耦合三维解析解

doi: 10.21656/1000-0887.460016
基金项目: 

国家自然科学基金(11872336)

详细信息
    作者简介:

    张友源(2000—), 男, 硕士生(E-mail: 1161321979@qq.com);范慧朵(1999—), 女, 硕士生(E-mail: 19857129053@163.com);沈璐璐(1990—), 女, 副教授, 博士(E-mail: lulushen@zstu.edu.cn);杨博(1979—), 男, 教授, 博士(通讯作者. E-mail: youngbo@zstu.edu.cn).

    通讯作者:

    杨博(1979—), 男, 教授, 博士(通讯作者. E-mail: youngbo@zstu.edu.cn).

  • 中图分类号: O343.8

3D Analytical Solutions of Mechatronic Coupling for Functionally Graded Piezoelectric Material Plates With a Circular Hole

Funds: 

The National Science Foundation of China(11872336)

  • 摘要: 在推广后的EnglandSpencer功能梯度板理论基础上,该研究进一步将功能梯度弹性材料推广到了功能梯度压电材料,研究了含有圆孔无限大横观各向同性功能梯度压电材料板在机械荷载作用下的三维响应.该板理论将三维问题转化为二维问题,利用复变函数解法,通过求解四个解析函数获得具体边值问题的三维解析解.针对在无穷远处受机械荷载作用的含圆孔功能梯度压电材料板,利用边界条件确定了四个解析函数的具体表达形式.通过数值算例讨论了材料参数沿板厚方向呈指数函数梯度变化时,边界条件和相关参数对圆孔边上三维应力的影响.该解析方法可为分析功能梯度压电板的三维孔口问题提供有效解析求解手段.
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出版历程
  • 收稿日期:  2025-01-24
  • 修回日期:  2025-03-24
  • 网络出版日期:  2025-12-05

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