PCB焊点热循环失效分析和改进设计

苏佩琳; 李涛; 彭雄奇

doi:10.3879/j.issn.1000-0887.2015.04.009

PCB焊点热循环失效分析和改进设计

doi: 10.3879/j.issn.1000-0887.2015.04.009

上海交通大学材料科学与工程学院, 上海 200030

基金项目: 国家自然科学基金(11172171)

详细信息

作者简介:
苏佩琳（1991—），女，湖北荆门人，硕士生(E-mail: su7259@163.com);彭雄奇（1970—），男，湖南娄底人，教授，博士生导师(通讯作者. E-mail: xqpeng@sjtu.edu.cn).

中图分类号: TG404;TG405
计量
- 文章访问数: 1394
- HTML全文浏览量: 138
- PDF下载量: 930
- 被引次数: 0
出版历程
- 收稿日期: 2014-10-21
- 修回日期: 2015-01-07
- 刊出日期: 2015-04-15

Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles

School of Materials Science and Engineering, Shanghai Jiao Tong University,Shanghai 200030, P.R.China

Funds: The National Natural Science Foundation of China(11172171)

摘要

摘要: 针对PCB（印制电路板）焊点在高低温热循环下的失效，建立了传统结构的三维模型和在芯片边角下加锡块的改进设计模型，通过实验测得FR-4的弹性模量和热膨胀系数，用ANSYS计算了PCB在高低温循环下的应力应变，并用修正的Coffin-Manson经验方程计算了焊点的热循环寿命。结果表明，通过在芯片边角下加锡块，PCB焊点的最大等效塑性应变显著降低，其热疲劳寿命得到明显提高.
- PCB /
- 热循环 /
- 有限元模拟 /
- 疲劳寿命
Abstract: To investigate the fatigue failure of PCB solder joints under thermal impact cycles, a 3D finite element model of PCB with the traditional structure was built. For comparison, an improved structural model with solder pads added at the QFN corners was also built. Based on the measurement of Young’s moduli and thermal expansion coefficients of FR4 by experiment, the thermomechanical FE analysis was conducted on the 2 models in ANSYS. The thermal fatigue life of the PCB solder joints was evaluated by means of the modified CoffinManson equation according to the FEA results. It is found that the peak equivalent plastic strain at the PCB solder joints is significantly reduced after addition of the solder pads at the QFN corners, and the thermal fatigue life of the PCB solder joints was thus greatly improved.
- PCB /
- thermal cycle /
- finite element analysis /
- fatigue life

HTML全文

参考文献(15)

[1]	Tohmyoh H, Ishikawa S, Watanabe S, Kuroha M, Nakano Y. Estimation and visualization of the fatigue life of Pb-free SAC solder bump joints under thermal cycling[J].Microelectronics Reliability,2013,53(2): 314-320.
[2]	刘建涛, 杜平安, 黄明镜, 周晴. 结构疲劳长裂纹扩展速率新模型研究[J]. 应用数学和力学, 2009,30(5): 538-546.(LIU Jian-tao, DU Ping-an, HUANG Ming-jing, ZHOU Qing. Research on new model of long fatigue crack propagation rates for structures[J].Applied Mathematics and Mechanics,2009,〖STHZ〗 30(5): 538-546.(in Chinese))
[3]	Sidhu R S, Chawla N. Thermal fatigue behavior of Sn-rich (Pb-free) solders[J].Metallurgical and Materials Transactions A,2008,39(4): 799-810.
[4]	吴玉秀, 薛松柏, 张玲, 黄翔. QFP 组件的优化模拟及焊点热疲劳寿命的预测[J]. 焊接学报, 2006,27(8): 99-102.(WU Yu-xiu, XUE Song-bai, ZHANG Ling, HUANG Xiang. Optimum simulation and prediction on thermal fatigue life of soldered joints of QFP devices[J].Transactions of the China Welding Institution,2006,27(8): 99-102.(in Chinese))
[5]	Xiao H, Li X, Yan Y, Liu N, Shi Y. Damage behavior of SnAgCu solder under thermal cycling[J].Rare Metal Materials and Engineering,2013,42(2): 221-226.
[6]	Zulkifli M N, Jamal Z A Z, Quadir G A. Temperature cycling analysis for ball grid array package using finite element analysis[J].Microelectronics International,2011,28(1): 17-28.
[7]	陈柳, 张群, 王国忠, 谢晓明, 程兆年. 倒装焊SnPb焊点热循环失效和底充胶的影响[J]. 半导体学报, 2001,22(1): 107-112.(CHEN Liu, ZHANG Qun, WANG Guo-zhong, XIE Xiao-ming, CHENG Zhao-nian. Thermal cycle failure of SnPb solder joint for flip chip package and effects of underfill material[J].Journal of Semiconductors,2001,22(1): 107-112.(in Chinese))
[8]	秦飞, 安彤. 焊锡材料的应变率效应及其材料模型[J]. 力学学报, 2010,42(3): 439-447.(QIN Fei, AN Tong. Strain rate effects and material models of solders[J].Chinese Journal of Theoretical and Applied Mechanics,2010,42(3): 439-447.(in Chinese))
[9]	王兴久, 沈煜年. 多芯片双面PCB的热应力分析[J]. 南京理工大学学报：自然科学版, 2010,34(2): 170-175.(WANG Xing-jiu, SHEN Yu-nian. Thermal stress analysis of double-sided PCB with multiple chips[J].Journal of Nanjing University of Science and Technology (Nature Science),2010,34(2): 170-175.(in Chinese))
[10]	Brown S B, Kim K H, Anand L. An internal variable constitutive model for hot working of metals[J].International Journal of Plasticity,1989,5(2): 95-130.
[11]	Anand L. Constitutive equations for the rate-dependent deformation of metals at elevated temperatures[J].Journal of Engineering Materials and Technology,1982,104(1): 12-17.
[12]	Motalab M, Cai Z, Suhling J C, Lall P. Determination of Anand constants for SAC solders using stress-strain or creep data[C]//13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (I Therm),IEEE, 2012: 910-922.
[13]	Che F X, Pang J H L. Characterization of IMC layer and its effect on thermomechanical fatigue life of Sn-3.8Ag-0.7Cu solder joints[J].Journal of Alloys and Compounds,2012,541: 6-13.
[14]	盛重, 薛松柏, 张亮, 皋利利. 基于蠕变模型倒装芯片焊点疲劳寿命预测[J]. 焊接学报, 2008,29(10): 53-56.(SHENG Zhong, XUE Song-bai, ZHANG Liang, GAO Li-li. Fatigue life prediction for flip chip soldered joints based on creep stain model[J].Transactions of the China Welding Institution,2008,29(10): 53-56.(in Chinese))
[15]	Engelmaier W. Fatigue life of leadless chip carrier solder joints during power cycling[J].IEEE Transactions on Components, Hybrids, and Manufacturing Technology,1983,6(3): 232-237.

施引文献

资源附件(0)

访问统计

计量

文章访问数: 1394
HTML全文浏览量: 138
PDF下载量: 930
被引次数: 0

姓名
邮箱
手机号码
标题
留言内容
验证码

留言板

PCB焊点热循环失效分析和改进设计

doi: 10.3879/j.issn.1000-0887.2015.04.009

作者简介:
苏佩琳（1991—），女，湖北荆门人，硕士生(E-mail: su7259@163.com);彭雄奇（1970—），男，湖南娄底人，教授，博士生导师(通讯作者. E-mail: xqpeng@sjtu.edu.cn).

计量

Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles

计量

目录

留言板

PCB焊点热循环失效分析和改进设计

doi: 10.3879/j.issn.1000-0887.2015.04.009

作者简介: 苏佩琳（1991—），女，湖北荆门人，硕士生(E-mail: su7259@163.com);彭雄奇（1970—），男，湖南娄底人，教授，博士生导师(通讯作者. E-mail: xqpeng@sjtu.edu.cn).

计量

出版历程

Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles

计量

出版历程

目录

作者简介:
苏佩琳（1991—），女，湖北荆门人，硕士生(E-mail: su7259@163.com);彭雄奇（1970—），男，湖南娄底人，教授，博士生导师(通讯作者. E-mail: xqpeng@sjtu.edu.cn).