Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles

SU Pei-lin; LI Tao; PENG Xiong-qi

doi:10.3879/j.issn.1000-0887.2015.04.009

Volume 36 Issue 4

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SU Pei-lin, LI Tao, PENG Xiong-qi. Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles[J]. Applied Mathematics and Mechanics, 2015, 36(4): 414-422. doi: 10.3879/j.issn.1000-0887.2015.04.009

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Fatigue Failure Analysis and Structural Improvement of PCB Solder Joints Under Thermal Cycles

doi: 10.3879/j.issn.1000-0887.2015.04.009

School of Materials Science and Engineering, Shanghai Jiao Tong University,Shanghai 200030, P.R.China

Funds: The National Natural Science Foundation of China(11172171)

Received Date: 2014-10-21
Rev Recd Date: 2015-01-07
Publish Date: 2015-04-15

Abstract

Abstract

To investigate the fatigue failure of PCB solder joints under thermal impact cycles, a 3D finite element model of PCB with the traditional structure was built. For comparison, an improved structural model with solder pads added at the QFN corners was also built. Based on the measurement of Young’s moduli and thermal expansion coefficients of FR4 by experiment, the thermomechanical FE analysis was conducted on the 2 models in ANSYS. The thermal fatigue life of the PCB solder joints was evaluated by means of the modified CoffinManson equation according to the FEA results. It is found that the peak equivalent plastic strain at the PCB solder joints is significantly reduced after addition of the solder pads at the QFN corners, and the thermal fatigue life of the PCB solder joints was thus greatly improved.
- PCB,
- thermal cycle,
- finite element analysis,
- fatigue life

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References(15)

References

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