Shape Bifurcation of an Elastic Wafer Due to Surface Stress

YAN Kun; HE Ling-hui; LIU Ren-huai

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YAN Kun, HE Ling-hui, LIU Ren-huai. Shape Bifurcation of an Elastic Wafer Due to Surface Stress[J]. Applied Mathematics and Mechanics, 2003, 24(10): 1012-1016.

Citation:

YAN Kun, HE Ling-hui, LIU Ren-huai. Shape Bifurcation of an Elastic Wafer Due to Surface Stress[J]. Applied Mathematics and Mechanics, 2003, 24(10): 1012-1016.

Citation:

YAN Kun, HE Ling-hui, LIU Ren-huai. Shape Bifurcation of an Elastic Wafer Due to Surface Stress[J]. Applied Mathematics and Mechanics, 2003, 24(10): 1012-1016.

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Shape Bifurcation of an Elastic Wafer Due to Surface Stress

1.
University of Science and Technology of China, Hefei 230027, P.R.China;
2.
Institute of Applied Mechanics, Jinan University, Guangzhou 510632, P.R.China

Received Date: 2002-08-05
Rev Recd Date: 2003-05-13
Publish Date: 2003-10-15

Abstract

Abstract

A geometrically nonlinear analysis was proposed for the deformation of a free standing elastically isotropic wafer caused by the surface stress change on one surface.The link between the curvature and the change in surface stress was obtained analytically from energetic consideration.In contrast to the existing linear analysis,a remarkable consequence is that,when the wafer is very thin or the surface stress difference between the two major surfaces is large enough,the shape of the wafer will bifurcate.
- elastic wafer,
- curvature,
- surface stress,
- geometric nonlinearity

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References(15)

References

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