CAI Yan-hong, CHEN Hao-ran, TANG Li-qiang, YAN Cheng, JIANG Wan. Dynamic Stress Intensity Factor Analysis of Adhesively Bonded Material Interface With Damage Under Shear Loading[J]. Applied Mathematics and Mechanics, 2008, 29(11): 1376-1386.
Citation: CAI Yan-hong, CHEN Hao-ran, TANG Li-qiang, YAN Cheng, JIANG Wan. Dynamic Stress Intensity Factor Analysis of Adhesively Bonded Material Interface With Damage Under Shear Loading[J]. Applied Mathematics and Mechanics, 2008, 29(11): 1376-1386.

Dynamic Stress Intensity Factor Analysis of Adhesively Bonded Material Interface With Damage Under Shear Loading

  • Received Date: 2007-08-17
  • Rev Recd Date: 2008-09-26
  • Publish Date: 2008-11-15
  • The dynamic stress intensity factor (DSIF) at the interface in an adhesive joint under shear loading is investigated. The material damage was considered. By introducing dislocation density function and using integral transform, the problem was reduced to algebraic equations and could be solved with collocation dots method in the Laplace domain. Finally, the time response of DSIF was calculated with the inverse Laplace integral transform. The conclusions show that the mode Ⅱ DSIF increases with the shear relaxation parameter, shear module and Poisson ratio, but decreases with swell relaxation parameter. Damage shielding only occurs at the initial stage of crack propagation. The singular index of crack tip is 0.5 and independent of the material parameters and damage conditions of materials and time. The oscillatory index is controlled by viscoelastic material parameters.
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