层状陶瓷的材料力和裂纹力评估方法

陈昌荣

doi:10.21656/1000-0887.370088

层状陶瓷的材料力和裂纹力评估方法

doi: 10.21656/1000-0887.370088

陈昌荣

上海工程技术大学飞行学院, 上海 201620

基金项目: 国家自然科学基金（51175321）

详细信息

作者简介:
陈昌荣（1964—），男，教授, 博士（E-mail: 13761742152@163.com）.

中图分类号: O343
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- 被引次数: 0
出版历程
- 收稿日期: 2016-03-28
- 修回日期: 2016-04-21
- 刊出日期: 2016-07-15

A Method for Evaluating Material Forces and Crack Forces in Ceramic Laminates

CHEN Chang-rong

School of Flight Technology, Shanghai University of Engineering Science, Shanghai 201620, P.R.China

Funds: The National Natural Science Foundation of China（51175321）

摘要

摘要: 用J积分理论分析了层状陶瓷受弯曲载荷作用时J_far(0)，J_far(a)，J_far(a)-J_far(0)和J_tip的特点，这里J_far(0)，J_far(a)分别表示无裂纹时和裂纹长度为a时的远场J积分，J_t_ip表示裂尖J积分.裂纹是垂直于界面的表面裂纹，基本假设是裂纹只影响局部应力应变场.由于积分路径所包围的材料界面长度随积分路径变化，导致J_far(0)和J_far(a)都随积分路径变化，但当积分路径远离裂纹影响区域时J_far(a)-J_far(0)不再随路径变化.J_far(a)-J_far(0)可作为非均匀材料断裂的远场驱动力参量，J_tip-(J_far(a)-J_far(0))可用来评价材料非均匀性对裂纹扩展驱动力的促进或抑制作用.
- J积分 /
- 材料非均匀性 /
- 层状陶瓷 /
- 内应力 /
- 界面
Abstract: Characteristics of J_far(0), J_far(a), J_far(a)-J_far(0)and J_tip were analyzed for ceramic laminates under bending loads based on the J-integral theory. Here J_far(0) and J_far(a) were the far-field J-integrals corresponding to crack lengths 0 and a respectively. The crack was perpendicular to the interfaces. A basic assumption was that the crack length was small compared with the laminate thickness, and the stress and strain fields in the region far from the crack were little influenced by the crack. Both J_far(0) and J_far(a) were path-dependent, because the lengths of the interfaces enclosed by the path of integration varied with the path. However, J_far(a)-J_far(0) became path-independent when the path was far from the crack. J_far(a)-J_far(0) was seen as a parameter to represent the global driving force for fracture. The purpose is to make the present method available to evaluate the inhibiting or boosting effects of material inhomogeneities on the crack tip driving force by J_tip-(J_far(a)-J_far(0)).
- J-integral /
- material inhomogeneity /
- ceramic laminate /
- internal stress /
- interface

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