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负Poisson比热电器件的热-电-力耦合弯曲特征及强度分析

崔有江 刘超 陈家鹏 王彪 王保林

崔有江, 刘超, 陈家鹏, 王彪, 王保林. 负Poisson比热电器件的热-电-力耦合弯曲特征及强度分析[J]. 应用数学和力学, 2024, 45(10): 1243-1255. doi: 10.21656/1000-0887.450113
引用本文: 崔有江, 刘超, 陈家鹏, 王彪, 王保林. 负Poisson比热电器件的热-电-力耦合弯曲特征及强度分析[J]. 应用数学和力学, 2024, 45(10): 1243-1255. doi: 10.21656/1000-0887.450113
CUI Youjiang, LIU Chao, CHEN Jiapeng, WANG Biao, WANG Baolin. Thermo-Electric-Mechanical Coupling Bending Property and Strength Analyses of Thermoelectric Devices With the Negative Poisson’s Ratio Architecture[J]. Applied Mathematics and Mechanics, 2024, 45(10): 1243-1255. doi: 10.21656/1000-0887.450113
Citation: CUI Youjiang, LIU Chao, CHEN Jiapeng, WANG Biao, WANG Baolin. Thermo-Electric-Mechanical Coupling Bending Property and Strength Analyses of Thermoelectric Devices With the Negative Poisson’s Ratio Architecture[J]. Applied Mathematics and Mechanics, 2024, 45(10): 1243-1255. doi: 10.21656/1000-0887.450113

负Poisson比热电器件的热-电-力耦合弯曲特征及强度分析

doi: 10.21656/1000-0887.450113
基金项目: 

国家自然科学基金(12102104);广东省基础与应用基础研究基金(2022A1515240072;2022B1515020099;2022A1515010801;2023A1515240053)

详细信息
    作者简介:

    崔有江(1990—),男,副研究员,博士(E-mail: cuiyoujiang@dgut.edu.cn);王彪(1968—),男,教授,博士,博士生导师(通讯作者. E-mail: wangbiao@mail.sysu.edu.cn);王保林(1968—),男,教授,博士,博士生导师(通讯作者. E-mail: wangbl@hit.edu.cn).

    通讯作者:

    王彪(1968—),男,教授,博士,博士生导师(通讯作者. E-mail: wangbiao@mail.sysu.edu.cn).

  • 中图分类号: O341

Thermo-Electric-Mechanical Coupling Bending Property and Strength Analyses of Thermoelectric Devices With the Negative Poisson’s Ratio Architecture

Funds: 

The National Science Foundation of China(12102104)

  • 摘要: 随着智能可穿戴设备的快速发展,对供电元件的续航时间、便捷性以及轻量化等提出了更高要求.热电器件可以直接将人体新陈代谢释放的热能转换为电能,为可穿戴设备持续供电.利用整体-局部、细观-宏观相结合的分析方法,该文研究了负Poisson比热电器件的热-电-力耦合弯曲行为及其强度失效问题.首先,通过建立负Poisson比热电器件的均质化分析模型,获取了器件的宏观弯曲特征,并给出了应力最大的截面.然后,建立热电蜂窝的受力分析模型,利用热力学强度理论导出了胞壁的细观强度失效临界荷载.研究发现:热电蜂窝的应力水平随着内凹角增大呈现先减小后增加的趋势;对于负Poisson比热电蜂窝,强度失效首先发生在中间部位;对于传统的六边形热电蜂窝,端部比中间部位先发生强度破坏;热电器件发生断裂破坏时,中间和端部的临界裂纹长度近似相等,可以拟合为内凹角的指数函数.
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出版历程
  • 收稿日期:  2024-04-24
  • 修回日期:  2024-05-14
  • 网络出版日期:  2024-10-31
  • 刊出日期:  2024-10-01

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