## 留言板

Hamilton体系下层合板弱粘接模型的应用

 引用本文: 但敏. Hamilton体系下层合板弱粘接模型的应用[J]. 应用数学和力学, 2013, 34(1): 72-84.
DAN Min. Application of Composite Laminated Plates With Bonding Imperfection in Hamilton System[J]. Applied Mathematics and Mechanics, 2013, 34(1): 72-84. doi: 10.3879/j.issn.1000-0887.2013.01.008
 Citation: DAN Min. Application of Composite Laminated Plates With Bonding Imperfection in Hamilton System[J]. Applied Mathematics and Mechanics, 2013, 34(1): 72-84.

• 中图分类号: O343

## Application of Composite Laminated Plates With Bonding Imperfection in Hamilton System

• 摘要: 层合板的层间粘接模型对整个层合板的结构有重要影响．运用Hamilton正则方程对层合板层间的不同类型的粘接模型进行了分析．结合弹性材料修正后的HellingerReissner变分原理和插值函数，构建了直角坐标系下8节点层合板的每一层的线性方程；考虑到脱层板的连接界面处应力和位移的关系，改进了现有的常用弱粘接模型，建立不同粘接模型的控制方程；最后通过求解整个板的控制方程，得到层合板的层间应力和位移．数值算例验证了该模型的正确性，并研究了层间界面为线性和非线性时的问题．结果表明：应用改进后的弱粘接模型，能够更好地模拟层合板的弱界面失效过程．
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##### 出版历程
• 收稿日期:  2012-07-01
• 修回日期:  2012-12-09
• 刊出日期:  2013-01-15

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