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Hamilton体系下层合板弱粘接模型的应用

但敏

但敏. Hamilton体系下层合板弱粘接模型的应用[J]. 应用数学和力学, 2013, 34(1): 72-84. doi: 10.3879/j.issn.1000-0887.2013.01.008
引用本文: 但敏. Hamilton体系下层合板弱粘接模型的应用[J]. 应用数学和力学, 2013, 34(1): 72-84. doi: 10.3879/j.issn.1000-0887.2013.01.008
DAN Min. Application of Composite Laminated Plates With Bonding Imperfection in Hamilton System[J]. Applied Mathematics and Mechanics, 2013, 34(1): 72-84. doi: 10.3879/j.issn.1000-0887.2013.01.008
Citation: DAN Min. Application of Composite Laminated Plates With Bonding Imperfection in Hamilton System[J]. Applied Mathematics and Mechanics, 2013, 34(1): 72-84. doi: 10.3879/j.issn.1000-0887.2013.01.008

Hamilton体系下层合板弱粘接模型的应用

doi: 10.3879/j.issn.1000-0887.2013.01.008
详细信息
    作者简介:

    但敏(1983—),男,湖北大悟人,讲师,硕士(Tel:+862224092415; E-mail:danmincauc@163.com).

  • 中图分类号: O343

Application of Composite Laminated Plates With Bonding Imperfection in Hamilton System

  • 摘要: 层合板的层间粘接模型对整个层合板的结构有重要影响.运用Hamilton正则方程对层合板层间的不同类型的粘接模型进行了分析.结合弹性材料修正后的HellingerReissner变分原理和插值函数,构建了直角坐标系下8节点层合板的每一层的线性方程;考虑到脱层板的连接界面处应力和位移的关系,改进了现有的常用弱粘接模型,建立不同粘接模型的控制方程;最后通过求解整个板的控制方程,得到层合板的层间应力和位移.数值算例验证了该模型的正确性,并研究了层间界面为线性和非线性时的问题.结果表明:应用改进后的弱粘接模型,能够更好地模拟层合板的弱界面失效过程.
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出版历程
  • 收稿日期:  2012-07-01
  • 修回日期:  2012-12-09
  • 刊出日期:  2013-01-15

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